| PART |
Description |
Maker |
| LPC1830FBD144 LPC1830FET100 LPC1830FET180 LPC1830F |
0kB flash, 200kB SRAM, Ethernet, LQFP144 package
0kB flash, 200kB SRAM, Ethernet, TFBGA100 package
0kB flash, 200kB SRAM, Ethernet, TFBGA180 package
0kB flash, 200kB SRAM, Ethernet, LBGA256 package
|
NXP Semiconductors
|
| GE28F320W30B70 GE28F320W30B85 RD28F6408W30T85 28F6 |
Segmented Alphanumeric LED; Display Technology:LED; No. of Digits/Alpha:1; Body Material:GaAsP; LED Color:Red; Leaded Process Compatible:Yes; Luminous Intensity:7.5mcd RoHS Compliant: Yes 2M X 16 FLASH 1.8V PROM, PBGA56
1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30) 2M X 16 FLASH 1.8V PROM, PBGA56
1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30) SPECIALTY MEMORY CIRCUIT, PBGA80
1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30) 1.8伏英特尔无线闪存伏的I / O和SRAM（宽30
|
Intel, Corp.
Intel Corp.
|
| LPC1101LVUK LPC1102LVUK LPC1112LVFHI33 LPC1114LVFH |
32kB flash, 2kB SRAM, ADC,WLCSP package
32kB flash, 8kB SRAM, ADC, WLCSP package
16kB flash, 4kB SRAM, ADC, HVQFN32 package
32kB flash, 8kB SRAM, ADC, HVQFN32 package
|
NXP Semiconductors
|
| DS42553 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| DS42587 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| LPC1751FBD80 LPC1759-11 |
Cortex-M3 with 32 kB flash, 8 kB SRAM, USB 2.0 Device, CAN, 12-bit ADC
32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
|
NXP Semiconductors N.V.
|
| LPC4357FET256 LPC4357JET256 LPC4357JBD208 |
Dual-core Cortex-M4/M0, 1 MB Flash, 136 kB SRAM, 2 HS USB with on-chip PHY, Ethernet, LCD, CAN, AES, SPIFI, SGPIO, SCT
32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC
|
NXP Semiconductors
|
| LPC1115JBD48 LPC1114FBD48 LPC1111FDH20 LPC1111JHN3 |
32-bit ARM Cortex-M0 microcontroller??4kB flash, 8kB SRAM, LQFP48 package
32-bit ARM Cortex-M0 microcontroller??2kB flash, 8kB SRAM, LQFP48 package
32-bit ARM Cortex-M0 microcontroller??kB flash, 2kB SRAM, TSSOP20 package
32-bit ARM Cortex-M0 microcontroller??kB flash, 4kB SRAM, HVQFN32 package
32-bit ARM Cortex-M0 microcontroller??6kB flash, 4kB SRAM, HVQFN33 package
32-bit ARM Cortex-M0 microcontroller??6kB flash, 4kB SRAM, HVQFN32 package
|
NXP Semiconductors N.V.
|
| MB84VA2103-10 MB84VA2102 MB84VA2102-10 MB84VA2103 |
MCP (Multi-Chip Package) FLASH MEMORY & SRAM 16M (x16) FLASH MEMORY & 2M (x 8) STATIC RAM
|
Fujitsu Microelectronics
FUJITSU[Fujitsu Media Devices Limited]
|
| A82DL16X2T A82DL1622 A82DL1622TG-70 A82DL1622TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
|
AMICC[AMIC Technology]
|
| LPC3230FET296 |
ARM926EJ-S with 256 kB SRAM, USB High-speed OTG, SD-MMC, NAND flash controller, LCD controller 32-BIT, FLASH, 266 MHz, RISC MICROCONTROLLER, PBGA296
|
NXP Semiconductors N.V.
|
|
